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                  DMS系列

                  DMS系列高导热铝合金开发①背景:近年来PC等电子电器产品倾向于高速化、小型化。迄今为止散热装置所采用的JIS合金的散热性能已难以满足要求。市场对于具有更高导热性能的材料的需求也日趋高涨。

                  DMS1:追求高热传导性的合金

                  DMS3:高热传导性和良好的铸造性能兼备的合金

                  DMS4:维持高热传导性的同时,具有较高强度的合金

                  DMS5:ADC12的换代产品。热传导率约为ADC12的1.6倍

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